At the Display Innovation 2014 (FPD International) held in Yokohama, Japan from October 29 2014, Japan Display (JDI) unveiled the flexible AMOLED panel for the first time.
The flexible AMOLED panel which was presented this time employed WRGB method with PI substrate, and it is 5.2inch (FHD, 423PPI) TFE (thin film encapsulation) applied panel with the thickness of 0.05mm.
It is a new AMOLED panel released after a year and a half since the glass type 5.2-inch FHD AMOLED panel was made public on March 2013, and it demonstrates JDI’s will of business on the AMOLED panel for mobile device.
Company official from JDI OLED R&D group said, the precise time cannot be provided but they are preparing for the mass production of AMOLED panel for mobile device and the product targets are set for both flexible and glass types.
JDI is developing AMOLED panel for mobile devices at the Gen6 LTPS line of Ishikawa.
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