On 9 September, AIXTRON, a deposition equipment production company, revealed that they supplied encapsulation equipment OPTACAP to a major Asian display maker.
OPTACAP encapsulation is a research equipment that handles substrates size of 200mm x 200mm. AIXTRON revealed that this was ordered in the third quarter in 2015 and is scheduled to be delivered in the first quarter of 2016. The OPTACAP’s PECVD technology enables the deposition of barrier film used in TFE process of OLED display, OLED lighting, organic photovoltaic and flexible electronic device.
CTO (chief technology officer) of AIXTRON, Andreas Toennis, said, “thin-film encapsulation is an essential step within the OLED manufacturing process. Therefore, we are delighted to be able to provide an innovative solution to the industry which delivers excellent barrier films at high throughput. Therefore, this solution contributes to a significant reduction of manufacturing costs for the critical encapsulation process step within the production of flexible as well as rigid OLED devices”.
In April 2015, AIXTRON acquired PlasmaSi, located in Silicon Valley in order to develop OPTACAP encapsulation technology.